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SEMI 3D & Systems Summit Opens – Highlights Advanced Packaging for Emerging Technologies
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SEMI 3D & Systems Summit Opens – Highlights Advanced Packaging for Emerging Technologies

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DRESDEN, Germany — 27 January, 2020 — The SEMI 3D & Systems Summit opens today in Dresden, Germany, with top experts in 3D integration and systems for semiconductor manufacturing applications providing the year’s first comprehensive outlook for advanced packaging and systems. Themed Expanding Application Space, the annual three-day summit features the latest developments and insights in artificial intelligence (AI), 5G, heterogeneous integration, 3D roadmap and System-In-Package (SiP) technologies.